New Delhi — The Union Cabinet, led by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), with a total investment of ₹4,600 crore.
The proposals come from SiCSem, Continental Device India Pvt. Ltd. (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these additions, ISM now has 10 approved projects across six states, representing cumulative investments of about ₹1.6 lakh crore.
According to the Cabinet, these new facilities are expected to create 2,034 direct skilled jobs and boost the country’s electronics manufacturing ecosystem, leading to significant indirect employment as well.
Project details:
- SiCSem (Odisha) — Partnering with Clas-SiC Wafer Fab Ltd. (UK) to set up India’s first commercial compound semiconductor fabrication unit in Bhubaneswar, focused on silicon carbide devices. Annual capacity: 60,000 wafers and 96 million packaged units. Applications include defence systems, EVs, railways, chargers, data centers, consumer appliances, and solar inverters.
- 3D Glass Solutions Inc. (Odisha) — Building an advanced packaging and embedded glass substrate unit with cutting-edge technology, including 3D heterogeneous integration modules. Annual capacity: ~69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. Applications include defence, AI, high-performance computing, RF and automotive, and photonics.
- ASIP Technologies (Andhra Pradesh) — In collaboration with APACT Co. Ltd. (South Korea), setting up a unit with an annual capacity of 96 million units for mobile phones, set-top boxes, automotive electronics, and other products.
- CDIL (Punjab) — Expanding its Mohali facility to produce high-power discrete semiconductors like MOSFETs, IGBTs, Schottky diodes, and transistors in silicon and silicon carbide. Annual capacity: 158.38 million units. Applications include EVs, renewable energy, industrial power systems, and communications infrastructure.
The government highlighted that these projects complement India’s growing chip design capabilities, supported by infrastructure provided to 278 academic institutions and 72 start-ups. Over 60,000 students have already benefited from related talent development programs.
With inputs from IANS